advanced power p-channel enhancement mode electronics corp. power mosfet low gate charge bv dss -30v fast switching characteristic r ds(on) 10m simple drive requirement i d 3 -13.3a rohs compliant & halogen-free description absolute maximum ratings@ t j =25 o c(unless otherwise specified) symbol units v ds v v gs v i d @t a =25 a i d @t a =70 a i dm a p d @t a =25 w e as single pulse avalanche energy 4 mj t stg t j symbol value unit rthj-a maximum thermal resistance, junction-ambient 3 50 /w -30 + 20 -13.3 thermal data 2.5 -55 to 150 -55 to 150 drain current 3 , v gs @ 10v -10.6 28.8 parameter drain-source voltage gate-source voltage drain current 3 , v gs @ 10v AP3P010M rating halogen-free product 1 parameter pulsed drain current 1 -50 201708251 total power dissipation 3 operating junction temperature range storage temperature range a p3p010 series are from advanced power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. it provides the designer with an extreme efficient device for use in a wide range of power applications. the so-8 package is widely preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as dc/dc converters. s s s g d d d d g d s .
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =-250ua -30 - - v r ds(on) static drain-source on-resistance 2 v gs =-10v, i d =-12a - - 10 m v gs =-4.5v, i d =-8a - - 17 m v gs(th) gate threshold voltage v ds =v gs , i d =-250ua -1 - -3 v g fs forward transconductance v ds =-10v, i d =-12a - 38 - s i dss drain-source leakage current v ds =-24v, v gs =0v - - -10 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 100 na q g total gate charge i d =-8a - 34 54.4 nc q gs gate-source charge v ds =-15v - 10 - nc q gd gate-drain ("miller") charge v gs =-4.5v - 12 - nc t d(on) turn-on delay time v ds =-15v - 11 - ns t r rise time i d =-1a - 9 - ns t d(off) turn-off delay time r g =3.3 - 150 - ns t f fall time v gs =-10v - 70 - ns c iss input capacitance v gs =0v - 3800 6080 pf c oss output capacitance v ds =-15v - 500 - pf c rss reverse transfer capacitance f=1.0mhz - 345 - pf r g gate resistance f=1.0mhz - 9 18 source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =-2.1a, v gs =0v - - -1.2 v t rr reverse recovery time i s =-10a, v gs =0 v , - 27 - ns q rr reverse recovery charge di/dt=100a/s - 16 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test 4.starting t j =25 o c , v dd =-30v , l=0.1mh , r g =25 , v gs =-10v this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. AP3P010M 3.surface mounted on 1 in 2 copper pad of fr4 board, t < 10s ; 125 /w when mounted on min. copper pad. 2 .
AP3P010M fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature 2.01e+09 fi g 5. forward characteristic o f fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 20 40 60 80 001122 -v ds , drain-to-source voltage (v) -i d , drain current (a) -10v -7.0v -6.0v -5.0v v g = -4.0v t a =25 o c 0 10 20 30 40 50 001122 -v ds , drain-to-source voltage (v) -i d , drain current (a) t a = 150 o c -10v -7.0v -6.0v -5.0v v g = -4.0v 7 8 9 10 11 12 13 246810 -v gs , gate-to-source voltage (v) r ds(on) (m ) i d =-8a t a =25 o c 0.0 0.4 0.8 1.2 1.6 2.0 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d = -12a v g = -10v 0.0 0.4 0.8 1.2 1.6 2.0 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th) 0 4 8 12 16 20 0 0.2 0.4 0.6 0.8 1 1.2 -v sd , source-to-drain voltage (v) -i s (a) t j =25 o c t j =150 o c i d = -250ua .
AP3P010M fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance 2.01e+09 fig 11. transfer characteristics fig 12. drain current v.s. ambient temperature 4 0 2 4 6 8 10 0 20406080 q g , total gate charge (nc) -v gs , gate to source voltage (v) i d =-8a v ds = -15v 0 2000 4000 6000 8000 1 5 9 13 17 21 25 29 33 37 -v ds , drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) p dm t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse duty factor = t/t peak t j = p dm x r thja + t a r thja =125 o c/w 0.01 0.1 1 10 100 0.01 0.1 1 10 100 -v ds , drain-to-source voltage (v) -i d (a) t a =25 o c single pulse 100us 1ms 10ms 100ms 1s dc operation in this area limited by r ds(on) 0 4 8 12 16 25 50 75 100 125 150 t a , ambient temperature ( o c ) -i d , drain current (a) 0 10 20 30 40 50 60 0123456 -v gs , gate-to-source voltage (v) -i d , drain current (a) t j =150 o c t j =25 o c v ds = -5v t j = -55 o c .
AP3P010M fig 13. normalized bv dss v.s. junction fig 14. total power dissipation temperature fig 15. typ. drain-source on state resistance 5 0 1 2 3 4 0 50 100 150 t a , ambient temperature( o c) p d , power dissipation(w) 0 0.4 0.8 1.2 1.6 2 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized bv dss i d = -1ma 0 20 40 60 80 100 0 102030405060 -i d , drain current (a) r ds(on) (m ) t j =25 o c -4.5v v gs = -10v .
AP3P010M marking information 6 3p010 ywwsss part numbe r date code (ywwsss) y last digit of the year ww week sss sequence .
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